Etching a substrate: processes – Nongaseous phase etching of substrate – Projecting etchant against a moving substrate or controlling...
Patent
1997-02-12
1998-07-14
Kunemund, Robert
Etching a substrate: processes
Nongaseous phase etching of substrate
Projecting etchant against a moving substrate or controlling...
216 97, 216 99, 134 13, B44C 122, B08B 600
Patent
active
057799288
ABSTRACT:
A film dissolving liquid is ejected from a needle-shaped nozzle onto a peripheral edge portion of a substrate surface of a SOG film, while being subjected to the film dissolving liquid. The substrate is rotated in order to dissolve and remove the SOG film from the peripheral edge portion of the substrate. The film dissolving liquid is a solvent or mixture of two or more solvents selected from the group cyclohexanone, .gamma.-butyrolactone, ethyl lactate or ethyl pyruvate. As a result, a swelling of the SOG film is not created at the edge portion of the substrate. A crack is not therefore created at the edge portion of the SOG film, and generation of particles due to a damage at the film swelling portion thereof is prevented.
REFERENCES:
patent: 4011351 (1977-03-01), Gipstein et al.
patent: 5328871 (1994-07-01), Tanigawa et al.
"Corrosion of Silica Glass by Aqueous Solutions of Organic Compounds"; Rybarikova et al.; abstract only; Ceram.-Silik (1996), 40(3).
Mitsuhashi Tsuyoshi
Yabe Manabu
Yamashita Tetsuro
Dainippon Screen Mfg. Co,. Ltd.
Goudreau George
Kunemund Robert
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