Film deposition apparatus and film deposition method

Details Film deposition apparatus and film deposition method Film deposition apparatus and film deposition method

2006-09-26

2006-09-26

Chen, Bret (Department: 1762)

Coating processes

Direct application of electrical, magnetic, wave, or...

Chemical vapor deposition

C427S077000

Reexamination Certificate

active

07112353

ABSTRACT:
A film deposition apparatus for forming a film on a substrate includes a chamber capable of maintaining a reduced-pressure atmosphere. The chamber includes a control electrode, a substrate holder opposite to the control electrode, the substrate holder holding the substrate, and a filament for emitting electrons disposed between the substrate holder and the control electrode. The film deposition apparatus further includes a unit for controlling the potential applied to the control electrode to be lower than the potential applied to the filament and a unit for controlling the potential applied to the substrate to be higher than the potential applied to the filament.

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Hideki Matsumura, “Summary of Research in NEDO Cat—CVD Project in Japan”; Ext. Abstr. 1stIntern. Conf. On Cat-CVD Process, Nov. 1-14, 2000, Kanazawa, Japan.

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