Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1991-07-12
1993-09-21
Simmons, David A.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156544, 156556, 206389, 206408, 206416, 354178, 354274, 354275, 354277, 354319, 354322, B32B 300
Patent
active
052465217
ABSTRACT:
A pair of teremps of a knitted structure are bonded to a blank of a shell plate of a film cartridge. A pair of teremps in continuous lengths is conveyed in the longitudinal direction thereof with the piled side of each of the teremps kept in contact with a locator member. The teremps in continuous lengths are bonded to opposite side edges of the blank and then cut to conform to the blank. Before they are brought into contact with the locator members, the teremps in continuous lengths are subjected to a process in which the pile is substantially uniformly oriented rearward at an angle with respect to the direction in which the teremps are conveyed.
REFERENCES:
patent: 4212389 (1980-07-01), Robbins
patent: 4429976 (1984-02-01), Sekine et al.
patent: 4505387 (1985-03-01), Seto
patent: 4568590 (1986-02-01), Iwai
patent: 4730778 (1988-03-01), Akao et al.
patent: 4787506 (1988-11-01), Akao
patent: 4832197 (1989-05-01), Hara
patent: 4862579 (1989-09-01), Takahashi et al.
patent: 4867815 (1989-09-01), Hoffacker et al.
patent: 4891089 (1990-01-01), Takashashi et al.
Mizuno Kazunori
Mizutani Shigemitsu
Shimura Hiromi
Suehara Kazuyoshi
Takahashi Koichi
Dixon Merrick
Fuji Photo Film Co. , Ltd.
Simmons David A.
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