Film composition and method for a planar surface atop a plated t

Radiation imagery chemistry: process – composition – or product th – Stripping process or element

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430258, 430313, 430319, 427 97, 428195, G03C 1112, B32B 300

Patent

active

060370963

ABSTRACT:
The present invention relates to a method for planarizing circuit board apertures wherein a photoimageable film composition comprising a photoimageable dielectric composition and a support film is employed to fill the circuit board apertures. Precircuitized and postcircuitized embodiments are discussed.

REFERENCES:
patent: 4127436 (1978-11-01), Friel
patent: 4567128 (1986-01-01), Bennett
patent: 4572764 (1986-02-01), Fan
patent: 4927733 (1990-05-01), Stout
patent: 5240817 (1993-08-01), Stout et al.
patent: 5277929 (1994-01-01), Seki et al.
patent: 5536620 (1996-07-01), Dueber et al.
patent: 5557844 (1996-09-01), Bhatt et al.
patent: 5571593 (1996-11-01), Arldt et al.
patent: 5643657 (1997-07-01), Dueber et al.

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