Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent
1997-01-31
1998-12-01
Niebling, John
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
438121, 438122, 438124, 438125, 438460, 438977, H01L 2144, H01L 2148, H01L 2150
Patent
active
058438106
ABSTRACT:
A reinforcing ring surrounding a semiconductor element connected electrically to respective interconnecting portions through electrodes is provided as one body through suspending portions. A film circuit is produced by forming a ring in place of an outer lead for instance by applying a lead frame forming technique in which a laminate of three layers or more is used as a base, an inner lead is formed on one side and an outer lead is formed by a surface layer on another side. In this manner, in a film circuit composed of an insulating film and a plurality of interconnecting portions (leads) electrically connecting between electrodes and other electronic components of a semiconductor element on at least one principal plane of the insulating film, it is made possible to align a ring surrounding a semiconductor element with respect to the semiconductor element only by placing the film circuit on the semiconductor element, and in its turn to reduce assembly mandays of a semiconductor device.
REFERENCES:
patent: 5422514 (1995-06-01), Griswold et al.
patent: 5474957 (1995-12-01), Urushima
patent: 5541447 (1996-07-01), Maejima et al.
patent: 5656550 (1997-08-01), Tsuji et al.
Osawa Kenji
Sato Kazuhiro
Niebling John
Sony Corporation
Zarneke David
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