Film chip capacitor

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

Patent

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Details

361323, H01G 113, H01G 408

Patent

active

046959211

ABSTRACT:
A chip capacitor comprising a plurality of parallel plastic organic film ers which film layers may further include organically bonded ceramic particles, interleaved with multiple thin parallel non-precious metal electrode film layers of aluminum, copper or the like, the capacitor further comprising suitable non-precious metal end caps and connector means the surfaces of adjacent dielectric films and electrodes being bonded together using bonding agents selected to provide the mechanical stability of the film chip capacitor.

REFERENCES:
patent: 2607825 (1952-08-01), Eisler
patent: 2842726 (1958-07-01), Robinson et al.
patent: 2887634 (1959-05-01), Peck et al.
patent: 3012176 (1961-12-01), Williams et al.
patent: 3049651 (1962-08-01), Adelson et al.
patent: 3118095 (1964-01-01), Baron et al.
patent: 3319141 (1967-05-01), Cariou et al.
patent: 3328654 (1967-06-01), Wilson
patent: 3710210 (1973-01-01), Heron
patent: 3710211 (1973-01-01), Behn et al.
patent: 3740623 (1973-06-01), Toro
patent: 4220547 (1980-09-01), Abe et al.
patent: 4451869 (1984-05-01), Sakabe et al.
patent: 4555746 (1985-11-01), Mochizuki et al.

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