Film carrier tape for mounting electronic devices thereon

Details Film carrier tape for mounting electronic devices thereon Film carrier tape for mounting electronic devices thereon

2006-06-13

2006-06-13

Lam, Cathy F. (Department: 1775)

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

C428S209000, C428S344000, C205S078000, C205S205000, C427S250000

Reexamination Certificate

active

07060364

ABSTRACT:
A film carrier tape for mounting electronic components or devices that excels in not only migration resistance but also adhesiveness of wiring to insulating film; and a process for producing the same. The film carrier tape for mounting electronic components or devices has seed layer comprising a zinc layer superimposed on a treated surface of insulating film and a nickel base metal layer superimposed on a surface of a zinc layer, or comprising a layer of alloy containing elemental nickel and elemental zinc in specified proportion, superimposed on a treated surface of insulating film). In the film carrier tape for mounting electronic components or devices, at least part of a region extending across a width of wiring from an edge side thereof to the treated surface of the insulating film may be continuously covered with a zinc coating layer comprising elemental zinc.

REFERENCES:
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patent: 5028513 (1991-07-01), Murakami et al.
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patent: 5573845 (1996-11-01), Parthasarathi et al.
patent: 5709957 (1998-01-01), Chiang et al.
patent: 5863666 (1999-01-01), Merchant et al.
patent: 6242078 (2001-06-01), Pommer et al.
patent: 6630743 (2003-10-01), Magnuson et al.
patent: 2004/0251537 (2004-12-01), Choi

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