Film carrier tape for mounting an electronic part

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – In combination with or also constituting light responsive...

Reexamination Certificate

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Details

C257S099000, C257S666000, C257S677000, C257S781000, C257S784000

Reexamination Certificate

active

06891198

ABSTRACT:
A film carrier tape for mounting an electronic part comprising an insulating film and a wire pattern which is made of a conductive metal and is provided on the surface of the insulating film, wherein an undercoating layer containing nickel as a main constituent is formed on at least a part of the surface of the wiring pattern made of a conductive metal, an intermediate layer containing palladium as a main constituent is formed on the surface of he undercoating layer, a surface layer containing gold as a main constituent is formed on the surface of the intermediate layer, and the average thickness of the intermediate layer containing palladium as a main constituent is not more than 0.04 μm.

REFERENCES:
patent: 5120665 (1992-06-01), Tsukagoshi et al.
patent: 5821627 (1998-10-01), Mori et al.
patent: 5990546 (1999-11-01), Igarashi et al.
patent: 6211052 (2001-04-01), Farnworth
patent: 10-084064 (1998-03-01), None
patent: 10-303254 (1998-11-01), None
patent: 11-102939 (1999-04-01), None
patent: 11-111782 (1999-04-01), None

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