Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
1995-06-05
2001-10-02
Graybill, David E. (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S111000, C438S122000, C438S123000
Reexamination Certificate
active
06297074
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention relates to a method and apparatus for cooling a laminated multi-chip semiconductor device through a connector which laminated semiconductor device includes film carrier (hereinafter referred to simply as TAB: Tape Automated Bonding) type semiconductor devices wherein a semiconductor chip is connected electrically to a film carrier tape.
A conventional multi-chip semiconductor device cooling method is disclosed in Japanese Utility Model Laid Open No. 36052/88 wherein the cooling is effected through radiation fins attached to semiconductor chips arranged planarly on a substrate. Further, as a cooling method for a packaging structure of an overlay arrangement in an SOP (Small Outline Package), reference is made to Japanese Utility Model Laid Open No. 261166/87.
According to the above conventional techniques it has been easy to mount radiation fins directly onto a semiconductor chip. In a laminated multi-chip semiconductor device according to the TAB method, however, it is only the top or the bottom layer that permits the mounting of radiation fins. Its structure does not permit the mounting of radiation fins to intermediate layers. Therefore, no consideration is given to direct cooling of such intermediate layers. Consequently, in the case of using semiconductor chips which generate a large quantity of heat during operation, or when plural layers are operated at a time, there occurs malfunction or deterioration of the semiconductor chips due to overheating. Also, there has been a problem of deteriorated reliability of connecting portions caused by thermal fatigue.
SUMMARY OF THE INVENTION
It is therefore an object of the present invention to provide a method and apparatus for mitigating the influence of heat between the above intermediate layers of a laminated multi-layer semiconductor device and then effecting cooling of such intermediate layers positively.
It is another object of the present invention to provide a film carrier tape for a semiconductor device with a heat sink for enabling cooling of a semiconductor chip.
According to a feature of the present invention, at least a heat sink and/or a radiation fin is provided on each semiconductor chip and connector.
In accordance with the present invention, a heat sink can be formed onto each semiconductor chip without greatly changing the conventional manufacturing process for TAB type semiconductor devices. The heat generated is conducted to the exterior of a laminated multi-chip semiconductor device positively by the action of a heat sink mounted on each layer of a semiconductor chip. It is then released to the open air. Particularly in intermediate layers, therefore, the cooling is ensured as compared with the case where no heat radiation structure is provided. When different kinds of semiconductor chips are laminated, the interference of heat from one to another semiconductor chip can be suppressed by providing a heat insulator on each heat sink. As a result, the application range of a laminated multi-chip semiconductor device is expanded. Further, the radiation of heat from the lead-connector electrical connection is promoted by electrical conducting parts provided on the connector in place of through holes and serving as a radiation fin. Consequently, it is possible to suppress the rise of temperature in operation, prevent malfunction caused by the deterioration of performance, and improve the reliability of connections attained by the reduction of thermal stress generated.
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Microelectronics Packaging Handbook; New York, Van Nostrand Reinhold. pp. 411-413. TK7874.6824, 1988.
Miyano Ichiro
Sakaguchi Suguru
Serizawa Koji
Shinoda Tadao
Tanaka Hiroyuki
Antonelli Terry Stout & Kraus LLP
Graybill David E.
Hitachi , Ltd.
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