Film carrier semiconductor device

Details Film carrier semiconductor device Film carrier semiconductor device

1992-10-28

1994-09-27

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257737, 257778, H01L 2348

Patent

active

053509471

ABSTRACT:
A film carrier semiconductor device includes a film carrier tape, an outer lead bonding bump mounting portion, a semiconductor chip, inner lead bonding leads, and outer lead bonding bumps. The film carrier tape consists of a tape-like insulating material and has carrying and positioning sprocket holes in its both edge portions. The outer lead bonding bump mounting portion is formed in a central portion of the film carrier tape. The semiconductor chip is mounted on the outer lead bonding bump mounting portion and has electrode bumps formed on electrode pads. The inner lead bonding leads are formed into a predetermined pattern on the film carrier tape and connected to the electrode bumps. The outer lead bonding bumps are formed on the outer lead bonding bump mounting portion, to each of which one end of a corresponding one of the inner lead bonding leads is connected.

REFERENCES:
patent: 5029325 (1991-07-01), Higgins, III et al.
patent: 5083191 (1992-01-01), Ueda

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