Film carrier having tin and indium plated layers

Details Film carrier having tin and indium plated layers Film carrier having tin and indium plated layers

1988-12-09

1990-06-19

Gehman, Bryon P.

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

428646, 428929, 174 524, 439886, B32B 1502, H05K 105

Patent

active

049353128

ABSTRACT:
Film carriers for mounting electronic components such as semiconductor chips thereon have lead portions plated with a tin or tin alloy layer and further with an indium layer. The tin or tin alloy layer is 0.1-3 .mu.m thick and the indium layer 0.01-2 .mu.m thick. Alternatively, the leads have a tin or tin alloy plated portion having an indium diffusion layer, with an indium content of 0.2-50 wt %. The carriers are manufactured by a method which comprises plating the leads with tin or a tin alloy and then with indium, with or without heat treatment at 50.degree.-150.degree. C. to form an indium diffusion layer in the tin or tin alloy coating. Plating is done by electroless plating.

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