Film carrier and semiconductor device using the same

Details Film carrier and semiconductor device using the same Film carrier and semiconductor device using the same

1996-09-27

2000-01-04

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

257676, 257700, 257737, 438108, H01L 2348, H01L 2352, H01L 2940, H01L 23053

Patent

active

060113103

ABSTRACT:
Disclosed are a film carrier comprising an insulating layer having laid therein an electrically conductive circuit such that the circuit is not exposed on the surface thereof, wherein conductive passages from the conductive circuit to one surface of the insulating layer are formed in the insulating layer and via holes from said conductive circuit to the other surface of the insulating layer are formed and a semiconductor device prepared by mounting a semiconductor element on the insulating layer of the film carrier. The film carrier can sufficiently correspond to pitch-fining and high-density mounting of a semiconductor element wiring, can surely perform the connecting operation of inner lead bonding and outer lead bonding and gives the mounting area of as small as possible.

REFERENCES:
patent: 5382827 (1995-01-01), Wang et al.
patent: 5468999 (1995-11-01), Lin et al.
patent: 5521332 (1996-05-01), Shikata et al.
patent: 5530287 (1996-06-01), Currie et al.
Patent Abstracts of Japan, vol. 018, No. 326 (E-1565), Jun. 21, 1994 & JP 06 077293 A (Nitto Denko Corp), Mar. 18, 1994, *the whole document*.

Affiliated with

Also associated with

Rating

Film carrier and semiconductor device using the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Film carrier and semiconductor device using the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Film carrier and semiconductor device using the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1074723