Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
1998-05-19
2001-03-27
Gaffin, Jeffrey (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S720000, C361S783000, C174S254000, C174S268000, C257S706000, C257S723000, C257S777000
Reexamination Certificate
active
06208521
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to a film carrier on which to mount a semiconductor element and a laminate type semiconductor device fabricated by mounting semiconductor elements on the film carrier.
BACKGROUND OF THE INVENTION
So as to meet the demand in recent years for highly functional, small electronics, a laminate type mounting structure has been proposed. In this structure, semiconductor elements (particularly naked IC chips cut out from a wafer) are mounted on film carriers and the film carriers are laminated on a substrate and connected (Japanese Patent Unexamined Publication No. 290048/1990).
For example, conventional laminate type mounting structures have the following construction. That is, as shown in
FIG. 13
, one semiconductor element
61
is mounted on one TAB tape and plural TAB tapes are laminated on an external circuit board
63
. Leads
62
formed on the TAB tapes on respective layers are connected to electrodes
64
of each external circuit board
63
.
In manufacturing such laminate type mounting structures, nevertheless, chips on TAB tapes are separately handled until they are laminated, since one chip is mounted on one TAB tape, which is inconvenient in transport and storage.
In the above-mentioned structure, moreover, leads
62
require modification of their bent shape and size thereof in every layer of laminate to reach external circuit board
63
, and such modification of the leads requires high technical skills.
When laminating, moreover, positioning of leads
62
of semiconductor element
61
and
64
of the electrodes external circuit board is difficult
It is also problematic that the connections between leads
62
and electrodes
64
of the external circuit board can only be made using a special connection tool (jig).
The TAB tape necessary for the mounting is expensive and the production cost of the above-mentioned structure becomes high. In addition, the above laminate type mounting structure does not have a structure to externally and efficiently release the heat generated in the semiconductor element in each layer.
It is therefore an object of the present invention to solve the above-mentioned problems and to provide a film carrier to be used for fabricating a new laminate type mounting structure.
Another object of the present invention is to provide a new laminate type mounting structure by mounting semiconductor elements on the film carrier of the present invention.
A further object of the present invention is to impart a heat-releasing structure to the laminate type mounting structure of the present invention.
SUMMARY OF THE INVENTION
The film carrier of the present invention comprises a plurality of film carrier members of the following (A) that are connected, via folding parts, in the direction of the extension of each plane. One of the film carrier members becomes a base member and the film carrier members other than the base member constitute a single laminate structure as a whole, upon folding the film carrier at the folding parts, whereby respective layers are laminated on the base member. The conductive circuits in the film carrier members are connected to the conductive circuit in the base member through the inside of the folding part In addition, a connection part to connect an external substrate is formed on a connection plane on the rear surface of the mounting plane of the base member. This connection part is electrically continuous with the conductive circuit
(A): a film carrier is to be the minimum unit constituting the inventive film carrier. It comprises a conductive circuit formed in an insulating substrate, and at least one surface of the insulating substrate is a mounting plane on which to mount a semiconductor element. The mounting plane having a mounting connection part is electrically continuous with to the conductive circuit.
The laminate type mounting structure of the present invention comprises the inventive film carrier. The film carrier comprises film carrier members respectively mounting semiconductor elements on the mounting planes thereof. The film carrier is folded at a folding part, whereby each film carrier member other than the base member is laminated on the base member. As a result, the connection plane of the base member becomes the lowermost plane of the laminate structure, thus forming a single laminate structure as a whole.
In the above-mentioned laminate type mounting structure of the present invention, a heat-absorbing plate (heat conduction type) is sandwiched at least between two layers from among the layers constituting the aforesaid laminate structure. A heat-releasing plate (heat conduction type) is set on the uppermost plane of the laminate structure. The heat-absorbing plate and heat-releasing plate are connected to each other in a heat conductive manner.
In the film carrier of the present invention, film carrier members in the number desired to be laminated are connected, via folding parts, in the extending direction of the plane in a developmental manner and connected to form a single film carrier. Thus, semiconductor elements can be easily mounted on a single film carrier. This means that there is no need to prepare a film carrier for each semiconductor element or to separately prepare for mounting of each semiconductor element, thereby eliminating dispersion of mounted semiconductor elements. In addition, a simple step of folding at the folding part enables integral lamination of plural semiconductor elements and easy positioning of the semiconductor elements.
In the inventive laminate type mounting structure, each of the mounted semiconductor elements is electrically continuous with a mounting connection part formed on the mounting plane of the base member, by a conductive circuit inside the insulating substrate, and the connection between layers has been completed. In the conventional laminate type mounting structure, individual film carriers are laminated on external circuit boards, and each layer and an external circuit board are connected by a lead to complete a laminate type mounting structure. In contrast, in accord with the inventive laminate type mounting structure, layers have been connected before establishing a connection with an external circuit board, and connection points with the external circuit board concentrate on one surface. By setting the laminate type mounting structure on an external circuit board, a laminate type mounting structure having an external terminal interchangeable with conventional products can be provided.
The connection between the inventive laminate type mounting structure and external circuit board is established utilizing the connection parts on the base members. The semiconductor element does not need to be connected to an external circuit board with a lead. Therefore, conventional problems of high technique and processing for lead bending, positioning of the lead and external circuit board, and the need to use a special tool can be entirely obliterated, and a connection to an external circuit board can be easily established.
In the present invention, moreover, the heat-releasing structure to be further set in the laminate type mounting structure has the following structure. That is, a heat-absorbing plate is sandwiched between desired layers from among the layers constituting the aforesaid laminate, preferably between all layers. In addition, a heat-releasing plate is set on the uppermost plane of the laminate. This heat-absorbing plate and the heat-releasing plate are connected in a heat conductive manner. This heat-releasing structure can be formed by merely folding a heat conductive plate, and thus, is a simple and effective one. Moreover, it can be easily incorporated into the laminate structure of the semiconductor elements on the film carrier of the present invention. This heat-releasing structure enables suitable conduction of the heat, generated by the action of the semiconductor element, to the heat-releasing plate from where the heat is released to the outside.
REFERENCES:
patent: 3242384 (1966-03-01), Klehm, Jr
Gaffin Jeffrey
Nitto Denko Corporation
Vigushin John B.
Wenderoth , Lind & Ponack, L.L.P.
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