Electricity: conductors and insulators – Conduits – cables or conductors – Single duct conduits
Patent
1987-09-25
1989-02-28
Nimmo, Morris H.
Electricity: conductors and insulators
Conduits, cables or conductors
Single duct conduits
29840, 2281802, H05K 100, H05K 334
Patent
active
048087696
ABSTRACT:
A film carrier according to this invention comprises a base film, a plurality of conductors formed on the base film, and a plurality of layers formed on the conductors, each being made of a low-melting point bonding metal. A bonding method of this invention comprises the steps of aligning the bonding metal layers of the film carrier with the terminals of an electronic part, and half-melting the bonding metal layers by thermo-compression, thereby to electrically connect the conductors of the film carrier to the terminals of the electronic part. The object of the present invention is to provide a film carrier which can serve to connect electronic parts to a circuit by means of a low pressure and at a low temperature, without causing damage to the electronic parts such as semiconductor elements, and also a bonding method using this film carrier.
REFERENCES:
patent: 3031747 (1962-05-01), Green
patent: 3544857 (1970-12-01), Byrne et al.
patent: 3646670 (1972-03-01), Maeda
patent: 3651562 (1972-03-01), Hambleton
patent: 3680198 (1972-08-01), Wood
patent: 3744121 (1973-07-01), Nagano et al.
patent: 3781596 (1973-12-01), Galli et al.
patent: 3811186 (1974-05-01), Larnerd et al.
patent: 3832769 (1974-09-01), Olyphant, Jr. et al.
patent: 3908075 (1975-09-01), Jackson et al.
patent: 3986255 (1976-10-01), Mandal
patent: 4110783 (1978-08-01), Onodera et al.
patent: 4142662 (1979-03-01), Holbrook et al.
patent: 4332341 (1982-06-01), Minetti
patent: 4442966 (1984-04-01), Jourdain et al.
patent: 4545610 (1985-10-01), Lakritz et al.
patent: 4666078 (1987-05-01), Ohno
Grossman, S. E.; Film-Carrier Technique Automates the Packaging of IC Chips; Electronics-Technical Articles; 5/16/74; pp. 89-95.
Nakano Hirotaka
Yoshino Thunekazu
Kabushiki Kaisha Toshiba
Nimmo Morris H.
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