Film carrier and a method for manufacturing a semiconductor devi

Details Film carrier and a method for manufacturing a semiconductor devi Film carrier and a method for manufacturing a semiconductor devi

1988-05-20

1989-10-17

Moy, Joseph Man-Fu

Special receptacle or package

For a vehicle

357 80, 357 70, H01L 3902

Patent

active

048740861

ABSTRACT:
A film carrier for a semiconductor device tested with a tester having a plurality of test pins arranged with predetermined interval, comprises a film substrate of insulating material. A plurality of conductive leads are arranged on the film substrate with predetermined spacing with respect to an adjacent one. Each lead has testing lead portion and circuit lead portion. The spacing between the adjacent testing lead portion is larger than the spacing between the adjacent circuit lead portion. The testing lead portion is removed partially from the conductive lead after an efficiency test.

REFERENCES:
patent: 3469684 (1969-09-01), Keady et al.
patent: 3659821 (1972-05-01), Sakamoto et al.
patent: 3858721 (1975-01-01), Boyer et al.
patent: 4417266 (1983-11-01), Grabbe
patent: 4496965 (1985-01-01), Orcutt et al.

Affiliated with

Also associated with

Rating

Film carrier and a method for manufacturing a semiconductor devi does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Film carrier and a method for manufacturing a semiconductor devi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Film carrier and a method for manufacturing a semiconductor devi will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1738968