Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With inspecting and/or illuminating means
Reexamination Certificate
2005-03-11
2011-12-06
Lee, Katarzyna Wyrozebski (Department: 1746)
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
With inspecting and/or illuminating means
C156S064000, C156S350000, C156S353000, C156S378000, C156S379600, C156S380700, C156S269000, C156S273700, C156S275100, C156S522000, C156S908000, C264S040100, C264S400000, C264S267000, C264S154000, C264S273000, C264S629000, C264S482000, C083S076400
Reexamination Certificate
active
08069892
ABSTRACT:
In a film bonding machine1including a laser oscillation means2for oscillating laser for processing a tape7bonded onto an end surface8of a columnar honeycomb structural body6by the laser oscillated from the laser oscillation means2, the film bonding machine1further includes an image pick-up means3having a moving type or tilt type mirror4capable of reflecting the end surface8of the honeycomb structural body6onto the same axis as the laser oscillation means2by reflected light and an image pick-up unit5for picking up the image of the end surface8of the honeycomb structural body6reflected by the mirror4. In the film bonding machine1, the processing position of the tape7bonded onto the end surface8of the honeycomb structural body6can be recognized by the image-pick means3on the same axis as the laser oscillation means2. As a result, the tape bonded onto the end surface of the honeycomb structural body can be accurately processed by the laser.
REFERENCES:
patent: 4557773 (1985-12-01), Bonzo
patent: 6811737 (2004-11-01), Fukuta et al.
patent: 2002/0020944 (2002-02-01), Yamaguchi et al.
patent: B2-61-51240 (1986-11-01), None
patent: A-01-233083 (1989-09-01), None
patent: A-5-115991 (1993-05-01), None
patent: A-09-057479 (1997-03-01), None
patent: A-9-85481 (1997-03-01), None
patent: A-2002-028915 (2002-01-01), None
patent: A-2002-126421 (2002-05-01), None
Enomoto Akio
Ota Tomoko
Lee Katarzyna Wyrozebski
NGK Insulators Ltd.
Oliff & Berridg,e PLC
Rivera Joshel
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