Electricity: measuring and testing – Measuring – testing – or sensing electricity – per se – With waveguide or long line
Reexamination Certificate
2005-06-07
2005-06-07
Nguyen, Vinh (Department: 2829)
Electricity: measuring and testing
Measuring, testing, or sensing electricity, per se
With waveguide or long line
C174S254000, C361S749000
Reexamination Certificate
active
06903541
ABSTRACT:
Flexible multilayer microwave or mm-wave circuits and sensors are provided having at least (a) a first metallization layer, at least a portion of the first metallization layer being adapted for operation at a frequency ranging from 20 GHz to 100 GHz; (b) a second metallization layer, at least a portion of the second metallization layer being adapted for operation as a ground plane; (c) a dielectric substrate layer, the dielectric substrate layer being disposed between the first and second metallization layers; and (d) a plurality of conductive vias extending through the dielectric substrate layer and electrically connecting portions of the first and second metallization layers.
REFERENCES:
patent: 3596228 (1971-07-01), Reed et al.
patent: 5282312 (1994-02-01), DiStefano et al.
patent: 5500556 (1996-03-01), Kosugi
patent: 5585162 (1996-12-01), Schueller
patent: 5631446 (1997-05-01), Quan
patent: 5879787 (1999-03-01), Petefish
patent: 5885710 (1999-03-01), MacDonald et al.
patent: 6477057 (2002-11-01), Buffet et al.
patent: 6486408 (2002-11-01), Morris
Steve Berry et al, “Flex Tape Use for Area-Array Substrates Will Grow Rapidly,” Jan.-Feb. 2000, Chip Scale Review, Internet address: http://www.chipscalerview.com/archives/ES/issues/0100/flex3.html.
Ernsberger, Craig N. and Thomas, Sunil, “Colaminated Single and Multichip Package Development,” 1997 International Conference on Multichip Modules, pp. 134-141 (May 1997).
F. Alessandri et al., “Full-Wave Modeling of Via Hole Grounds in Microstrip by Three-Dimensional Mode Matching Technique,” 1992 IEEE MTT-S Digest, pp. 1237-1240, (month unavailable).
Sletten Robert John
Ziegner Bernhard Alphonso
Kobert Russell M.
Nguyen Vinh
Tyco Electronics Corporation
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