Film adhesion device and film adhesion method

Details Film adhesion device and film adhesion method Film adhesion device and film adhesion method

2011-04-26

2011-04-26

Nguyen, Khanh (Department: 1746)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S268000, C156S250000, C156S248000

Reexamination Certificate

active

07931766

ABSTRACT:
A film adhesion device includes a table carrying a semiconductor wafer, a pressing member (pressing roller) which presses a film (photoresist film) onto a surface side of the semiconductor wafer placed on the table, a bumper member provided on an outer peripheral side of the table and including a contact surface which is contacted by the pressing member when the pressing member presses the film, and an elevating support mechanism which supports the bumper member elevatably and positions the bumper member at a predetermined height level.

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