Film acoustic wave device, manufacturing method and circuit...

Details Film acoustic wave device, manufacturing method and circuit... Film acoustic wave device, manufacturing method and circuit...

2007-03-27

2007-03-27

Budd, Mark (Department: 2834)

Electrical generator or motor structure

Non-dynamoelectric

Piezoelectric elements and devices

C029S025350

Reexamination Certificate

active

09778872

ABSTRACT:
The film acoustic wave devices (12a, 12band12c) having the same properties are obtained by changing at least one of the followings: the length and/or the width of upper electrode (18aand18b); the distance between the upper electrodes (18aand18b); the length and/or the width of connecting patterns (19aand19b); areas of bonding pads (20aand20b); and the pattern shape for the film acoustic wave device (12aand12b) such as the area of capacitor electrode connected electrically to the bonding pads (20aand20b); the property variations of film acoustic wave devices (12a, 12band12c) caused from the positioning at wafer11is compensated.

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Office Action from Canadian Intellectual Property Office, May 28, 2001.

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