Filling voids with filled hotmelt adhesive

Details Filling voids with filled hotmelt adhesive Filling voids with filled hotmelt adhesive

1996-04-22

1998-05-19

Niland, Patrick D.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

156 60, 1563314, 1563309, 156389, 4273722, 4273855, 4273881, 427389, 523218, 523219, 284231, 524442, 524492, 524493, 524494, C08J 300, C08K 334, C08L 7500, B31B 160

Patent

active

057537470

ABSTRACT:
A reactive hot melt adhesive and/or sealing composition having a heat of crystallization in joules/gram of -2 or lower, comprising a curable heat-flowable adhesive material and a particulate filler, wherein said composition has a thermal conductivity of less than 0.30 W/m.multidot..degree.C. The invention also relates to a method of using the adhesive/sealer composition described herein to fill a cavity or recess in a substrate and the filled substrates formed thereby.

REFERENCES:
patent: 3330782 (1967-07-01), Poppelsdorf
patent: 4005033 (1977-01-01), Georgeau et al.
patent: 4214019 (1980-07-01), Donermeyer et al.
patent: 4217376 (1980-08-01), Donermeyer et al.
patent: 4219459 (1980-08-01), Donermeyer et al.
patent: 4223067 (1980-09-01), Levens
patent: 4252712 (1981-02-01), Donermeyer et al.
patent: 4388424 (1983-06-01), Kennell et al.
patent: 4618525 (1986-10-01), Chamberlain et al.
patent: 4745139 (1988-05-01), Haasl et al.
patent: 4868012 (1989-09-01), Demoulin
patent: 5034453 (1991-07-01), Takada et al.
patent: 5137984 (1992-08-01), Kangas et al.
patent: 5258578 (1993-11-01), Smith et al.
patent: 5525663 (1996-06-01), Oien
H.T. Oien, "Effect of Thermodynamics on Filled Moisture Cured Hotmelts", Polyurethane 1995, 137-141 (Sep. 26-29, 1995).
H.T. Oien, "Effect of Thermodynamics on Filled Moisture Cure Hot Melts", Adhesives Age, 30-33 (Feb. 1996).
Encyclopedia of Chemical Technology, Kirk-Othmer, 2nd Ed., vol. 12, pp. 46-47, Interscience Pub., N.Y. (1967).
Jean-Michael Charrier, Polymeric Materials and Processing: Plastics, Elastomers and Composites, pp. 36-38, Hanser Publishers, New York, N.Y. (1990).

Affiliated with

Also associated with

Rating

Filling voids with filled hotmelt adhesive does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Filling voids with filled hotmelt adhesive, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Filling voids with filled hotmelt adhesive will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1853868