Filling material, multilayer wiring board, and process of...

Details Filling material, multilayer wiring board, and process of... Filling material, multilayer wiring board, and process of...

2003-07-09

2008-10-21

Lam, Cathy (Department: 1794)

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

C428S901000, C174S255000, C174S262000, C174S264000

Reexamination Certificate

active

07438969

ABSTRACT:
A solvent-free filling material comprising a filler, a thermosetting resin, a curing agent, and a curing catalyst, wherein the thermosetting resin is an epoxy resin, and the curing agent is a dicyandiamide curing agent; a multilayer printed wiring board comprising a substrate, a through-hole, the filling material filling the through-hole, and a conductor layer formed on an exposed surface of the filling material in the through-hole; and a process for producing the multilayer printed wiring board.

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