Filling material composition used for a process of manufacturing

Details Filling material composition used for a process of manufacturing Filling material composition used for a process of manufacturing

1996-04-25

1998-10-13

Berman, Susan W.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Compositions to be polymerized by wave energy wherein said...

522 79, 522 81, 522 83, 522120, 522141, 4302811, 430311, 430318, 428209, C08F 250, C08K 318, C08K 336

Patent

active

058212795

ABSTRACT:
A radiation curable filling material is used for a process of manufacturing a printed circuit board having plated landless through-holes. The material is filled in the through-holes and solidified in the through-holes via a photo polymerization to protect plated through-hole interior from an etching solution. The composition comprises a hydrophthalic acid monoester compound as a component (A); a catalyst for promoting photo polymerization of a vinyl group in the mono ester as a component (B); a highly transparent rosin having a Hazen color tone of 300 or less for the improvement of filling material transmission by radiation as a component (C), a powder of extender as a competent (D). The photo polymerization reaction occurs at the vinyl group of the hydrophthalic mono ester with the presence of the catalyst for promoting the photo polymerization. The rate of the reaction is enhanced by adding a vinyl compound such as an acrylate. The superior transmission of the highly transparent rosin enables to increase cure depth of the filling material.

REFERENCES:
patent: 4985474 (1991-01-01), Ogitani et al.
patent: 5212213 (1993-05-01), Hutter
translation of Japanese Kokai Patent No. Sho 62-59606, Somal Co., Ltd., Mar. 1987.

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