Alloys or metallic compositions – Containing over 50 per cent metal but no base metal – Copper containing
Reexamination Certificate
2011-08-02
2011-08-02
King, Roy (Department: 1733)
Alloys or metallic compositions
Containing over 50 per cent metal but no base metal
Copper containing
C420S589000, C148S442000
Reexamination Certificate
active
07988908
ABSTRACT:
Provided is a filler metal alloy composition capable of improving appearance of a welded zone and fluidity, penetration, etc., of an inexpensive filler metal by minimizing a content of silver (Ag) and adding tin (Sn) and silicon (Si) components. The filler metal alloy composition, brazed to a joint between parent metals to stably join the parent metals formed of the same material or different materials, is characterized in that the composition comprises silver (Ag), copper (Cu), zinc (Zn), tin (Sn), silicon (Si), and other unavoidable impurities.
REFERENCES:
patent: 05267299 (1993-10-01), None
Fujii et al., English machine translation of JP 05-267299, Oct. 15, 1993, whole document.
Kang Chung Yun
Kim Myoung Bok
Lee Dong Ha
Park Jae Jung
Fogarty Caitlin
King Roy
Korea Bundy Co., Ltd.
Sherr & Vaughn, PLLC
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