Filler for heat-conductive plastics materials

Details Filler for heat-conductive plastics materials Filler for heat-conductive plastics materials

1993-02-01

1994-09-06

Michl, Paul R.

Chemistry of inorganic compounds

Nitrogen or compound thereof

Binary compound

423353, 523220, 524428, 524439, 524786, C01B 21072

Patent

active

053446356

ABSTRACT:
A powder mixture of aluminium nitride in the form of sintered agglomerates with fractions of different particle size, which mixture comprises (1) 80 to 50% by weight of aluminium nitride in the form of sintered agglomerates having a mean particle diameter of 30 to 50 .mu.m, and (2) 20 to 50% by weight of aluminium nitride in the form of unsintered particles and having a mean particle diameter of 0.1 to 5 .mu.m. The mixture is suitable for use as filler for polymer materials, especially for casting resins, from which moulded parts of high thermal conductivity can be fabricated, for example potted electronic components.

REFERENCES:
patent: 4764489 (1988-08-01), Bolt
Derwent Publications Ltd, London AN90-063284.
Derwent Publications Ltd, London AN92-061825.

Affiliated with

Also associated with

Rating

Filler for heat-conductive plastics materials does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Filler for heat-conductive plastics materials, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Filler for heat-conductive plastics materials will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1328277