Filler for electronic element encapsulation resin and electronic

Details Filler for electronic element encapsulation resin and electronic Filler for electronic element encapsulation resin and electronic

1984-11-08

1986-10-07

Yarbrough, Amelia B.

Compositions: coating or plastic

Materials or ingredients

Miscellaneous

10628734, 523443, 524493, C04B 1404

Patent

active

046157417

ABSTRACT:
According to the invention, a filler for an electronic element encapsulation resin composition is provided. The filler comprises 5 to 95 parts by weight of fused silica beads of generally spherical form and 95 to 5 parts by weight of crushed particles of fused silica of rugged form. The resin composition admixed with the filler has excellent fluidity without the formation of burs when molded.

REFERENCES:
patent: 3975757 (1976-08-01), Sporck
patent: 3985842 (1976-10-01), Scott
patent: 4248920 (1981-02-01), Yoshizumi

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