Chemistry of inorganic compounds – Silicon or compound thereof – Oxygen containing
Patent
1988-02-29
1990-03-06
Schofer, Joseph L.
Chemistry of inorganic compounds
Silicon or compound thereof
Oxygen containing
423338, 423339, 523104, 524493, C01B 3312
Patent
active
049064460
ABSTRACT:
Silica gels of a mean grain size of about 0.5 to 50 .mu.m are subjected to a heat or acid treatment that considerably reduces their surface area and the volume of pores smaller than 50 nm, while maintaining approximately the same grain size distribution and amorphous structure. These products are colorless and can be worked into a resinous molding material in relatively large quantities, especially as a filler for dental materials based on polymerizable monomers, in particular mono-, di- or polyfunctional esters of acrylic or methacrylic acid. In the completely hardened condition, these materials have good mechanical characteristics, less polymerization shrinkage, very low thermal expansion coefficients, excellent transparency and tooth similarity resulting from the favorable refractive index of the filler, as well as very good ability to be polished and abrasion resistance.
REFERENCES:
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patent: 4036923 (1977-07-01), Laufer et al.
patent: 4217264 (1980-08-01), Mabie et al.
patent: 4306913 (1981-12-01), Mabie et al.
patent: 4388069 (1983-07-01), Orlowski
Concise Chemical and Technical Dictionary, H. Bennett, ed., Chemical Publishing Co., Inc., N.Y., N.Y., 1974, p. 939.
Engelbrecht Jurgen
Gunther Michael
von Wallis Helmut
Lipman Bernard
Schofer Joseph L.
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