Filled thixotropic resin compositions comprising epoxy resin, cu

Details Filled thixotropic resin compositions comprising epoxy resin, cu Filled thixotropic resin compositions comprising epoxy resin, cu

1991-04-11

1992-12-15

Bleutge, John C.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

528107, C08L 6300, C08G 5942, C07D31720

Patent

active

051717697

ABSTRACT:
A filled thixotropic resin composition (A) comprises a curable epoxide resin, a filler and, as thickening agent, a condensation product of a sugar alcohol with an aromatic aldehyde, the composition being thickened and made thixotropic such that the filler remains substantially uniformly dispersed therein on storage and such that upon addition of (B) a curing amount of a curing agent comprising a polyamine having at least one primary amine group attached directly to an aliphatic or cycloaliphatic carbon atom or a polycarboxylic acid anhydride, the curing agent substantially counteracts the thixotropic effect of the thickening agent to give a pourable curable composition which is no longer thixotropic and has a viscosity up to about 200 Pa s.

REFERENCES:
patent: 3892585 (1975-07-01), Sagane
patent: 3925278 (1975-12-01), Murai et al.
patent: 4286890 (1981-09-01), Dickmann et al.
Chem. Abst. 99, 112942j (1983).
Chem. Abst. 83, 133507f (1975).
Patent Absts. of Japan 13, 151 (C-584) (3499).
Patent Absts. of Japan 10, 362 (C-389) (2419).
Patent Absts. of Japan 11, 53 (C-404) (2500).
Patent Absts. of Japan 12, 338 (C-527) (3185).

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