Filled hot-melt adhesives containing modified polyethylene

Details Filled hot-melt adhesives containing modified polyethylene Filled hot-melt adhesives containing modified polyethylene

1978-08-30

1980-02-26

Person, Sandra M.

Chemistry of carbon compounds

Miscellaneous organic carbon compounds

260 42, 260 4246, 525185, C08K 334

Patent

active

041905652

ABSTRACT:
The hot-melt adhesives of the present invention comprise a blend of at least one modified polyethylene resin, at least one filler and a tackifying resin. This hot-melt adhesive has a novel combination of properties including excellent aging properties in combination with improved strength, low viscosity, and elevated temperature resistance properties.

REFERENCES:
patent: 2894925 (1959-07-01), Morris et al.
patent: 3480580 (1969-11-01), Jozner et al.
patent: 3481910 (1969-12-01), Brunson
patent: 3691120 (1972-09-01), Susuki et al.
patent: 3701760 (1972-10-01), Hazemeyer et al.
patent: 3856889 (1974-12-01), McConnell

Affiliated with

Also associated with

Rating

Filled hot-melt adhesives containing modified polyethylene does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Filled hot-melt adhesives containing modified polyethylene, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Filled hot-melt adhesives containing modified polyethylene will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2112646