Filled epoxy resin compositions

Details Filled epoxy resin compositions Filled epoxy resin compositions

2007-12-25

2007-12-25

Feely, Michael J. (Department: 1712)

Stock material or miscellaneous articles

Composite

Of epoxy ether

C438S127000, C523S427000, C523S440000, C523S443000, C523S444000, C523S445000, C523S466000, C525S525000

Reexamination Certificate

active

10967115

ABSTRACT:
An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavelength in the range of 400 to 900 nm, at an encapsulant thickness of about 1 mm. The encapsulant includes a filler consisting essentially of glass particles having diameters smaller than 500 μm, being essentially free of titania and lead oxide, and having a refractive index in the range of 1.48 to 1.60, with a variance of less than about 0.001. A method for making the encapsulant also is described, the method including steps of (1) processing the glass to form particles having diameters between 1 and 500 μm, (2) preparing an epoxy resin composition having at a cured stage a refractive index close to that of the glass filler particles, (3) mixing the epoxy resin composition with the filler particles to form a filled epoxy resin composition, (4) encapsulating an optoelectronic device with the filled epoxy resin composition, and (5) curing the filled epoxy resin composition.

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Machine translation of JP 2002-080698, provided by the JPO website.
Machine translation of JP 06-065473, provided by the JPO website.

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