Filled epoxy compositions

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Reexamination Certificate

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C428S323000, C428S332000, C428S413000, C523S440000, C523S443000, C523S466000

Reexamination Certificate

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07829188

ABSTRACT:
Epoxy compositions exhibiting low viscosity in the uncured state and low coefficient of thermal expansion in the cured state are provided. Also provided are processes for making the epoxy compositions. The low dielectric constant compositions are well-suited for use in multi-layer printed circuit boards. The desired properties are achieved by employment of a bimodal distribution of nano-scale fillers in the epoxy compositions.

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patent: 6881293 (2005-04-01), Nakamura et al.
patent: 7658988 (2010-02-01), Lin et al.
patent: 2004/0142155 (2004-07-01), Yokota et al.
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patent: 2007/0231469 (2007-10-01), Lin et al.
patent: 2-263858 (1990-10-01), None
patent: 2005-119929 (2005-05-01), None
Machine translation of JP 2005-119929 A, provided by the JPO website (2005).
Cochrane et. al., Hydrophobic Fumed Silica Control of Epoxy Rheology, Modern Paint and Coatings, 1983, pp. 1-6.
Epoxy Resins, The Encyclopedia of Polymer Science and Technology, 2004, vol. 9:678-904.

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