Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1994-05-24
1995-10-24
Aftergut, Jeff H.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156173, 156175, 156154, 156250, H01R 900, H05K 111, B65H 8100
Patent
active
054606772
ABSTRACT:
The micropin array is comprised of a plurality of micropins having a given diameter and being aligned in parallel to one another at a given pitch, insulating tubular coatings disposed to cover individual micropins, and an adhesive provided to fill spacings among the insulating tubular coatings. This micropin array is produced by the steps of preparing a plurality of coated wire materials composed of a metal core having a given diameter and an insulating tubular coating of a given thickness formed around the metal core, aligning closely and successively the coated wire materials to form a bundle thereof, fixing the bundle of the coated wire materials by means of an adhesive, and cutting the fixed bundle of the coated wire materials by a given length to form a micropin array.
REFERENCES:
patent: 3852878 (1974-12-01), Munro
patent: 3893233 (1975-07-01), Glover
patent: 3954317 (1976-05-01), Gilissen et al.
patent: 4330165 (1982-05-01), Sado
patent: 4729166 (1988-03-01), Lee et al.
patent: 4754546 (1988-07-01), Lee et al.
patent: 4999460 (1991-03-01), Sugiyama et al.
Aftergut Jeff H.
NEC Corporation
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