Figure layout compaction method and compaction device

Details Figure layout compaction method and compaction device Figure layout compaction method and compaction device

1997-10-17

2000-03-07

Teska, Kevin J.

3955001, 39550013, G06F 1750

Patent

active

06035108&

ABSTRACT:
A layout amendment specification section includes an input means such as a mouse and gives instructions to an section for compacting within allowable spacing, a wiring compaction section, a rewiring section, and an allowable spacing calculation section. The layout amendment specification section produces vertical ranking data for elements of terminals, via-holes, and wiring divided by each bent point of the wiring route. The allowable spacing calculation section produces vertical and horizontal sequence data that places all elements in order vertically and horizontally, and moreover, calculates the allowable spacing between terminals and via-holes. Based on the allowable spacing data, section for compacting within allowable spacing shifts the terminals and via-holes by pushing them down, and in addition, shifting the terminals and via-holes while maintaining a spacing of a gap compensation amount wherever possible that can accommodate one wire between a terminal or via-hole and an adjacent element.

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Valainis et al. "Two-Dimensional IC Layout Compaction Based on Topological Design Rule Checking," IEEE Transactions on Computer-Aided Design, vol. 9, No. 3, Mar. 1990.
Apanovich and Marchuk "DECOMP: A Technology Migration Subsystem for Full Chip Mask Layouts," IEEE, 1997.

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