Field implant for semiconductor device

Fishing – trapping – and vermin destroying

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437 69, 437 27, H01L 2176

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active

057892695

ABSTRACT:
The concentration of impurities at the surface of the semiconductor device adjacent and under the bird's beak of a field oxide region is reduced by employing sidewall spacers prior to field implantation. The resulting semiconductor device exhibits reduced sidewall junction capacitance and leakage, an increased junction breakdown voltage and a reduced narrow channel effect.

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Wolf, Silicon Processing for the VLSI Era--vol. II--Process Integration, Littice Press, 1990, pp. 22-23, Sections 2.2.2.4 and 2.2.2.5.
Rung et al., A Retrograde p-Well for Higher Density CMOS, IEEE Transactions on Electron Devices, vol. ED-28, No. 10, Oct., 1981, pp. 1115-1119.

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