Field emission micro-tip

Details Field emission micro-tip Field emission micro-tip

1995-07-31

1997-05-20

Horabik, Michael

Electric lamp and discharge devices

Electrode and shield structures

Point source cathodes

313309, 313351, 445 24, 445 50, H01J 102, H01J 902

Patent

active

056315198

ABSTRACT:
A field emission device has a rear substrate (11), a titanium or aluminum adhesive layer (12) and disposed on the substrate (11), a tungsten cathode (13) disposed on the adhesive layer (12), a micro-tip (13') protruding from the cathode (13), a titanium or aluminum mask layer (14) disposed on the cathode (13), and a metal pattern (15) formed on the mask layer (14) for supporting the cathode (13). The micro-tip (13') is formed by the simultaneous etching of the tungsten cathode (13), the adhesive layer (12), and the mask layer (14') resulting in a large internal stress in the micro-tip (13'). The residual internal stress in the micro-tip (13') results in the micro-tip (13') curving away from the substrate (11) which, consequently, facilitates electron emission.

REFERENCES:
patent: 5090932 (1992-02-01), Dieumegard et al.
patent: 5148079 (1992-09-01), Kado et al.
patent: 5382867 (1995-01-01), Maruo et al.
patent: 5386172 (1995-01-01), Komatsu
patent: 5457355 (1995-10-01), Fleming et al.

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