Field emission display

Electric lamp and discharge devices – With luminescent solid or liquid material – Vacuum-type tube

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313495, 313336, H01J 6300

Patent

active

059107057

ABSTRACT:
A flat-panel field emission display comprises a luminescent faceplate, a rigid backplate, and an interposed or sandwiched emitter or cathode plate. A positioning spacer or connector ridge is formed on the rear surface of the faceplate to space the cathode plate a fixed distance behind the faceplate. A peripheral seal is formed between the faceplate and the backplate. The faceplate, backplate, and peripheral seal define an evacuated internal space which contains the cathode plate. The backplate is spaced behind the cathode plate to create a rearward vacuum space in which a getter is located.

REFERENCES:
patent: 3665238 (1972-05-01), Van Esdonk et al.
patent: 4387283 (1983-06-01), Peterson et al.
patent: 4769345 (1988-09-01), Butt et al.
patent: 4857161 (1989-08-01), Borel et al.
patent: 4857799 (1989-08-01), Spindt et al.
patent: 4923421 (1990-05-01), Brodie et al.
patent: 5015912 (1991-05-01), Spindt et al.
patent: 5063327 (1991-11-01), Brodie et al.
patent: 5075591 (1991-12-01), Holmberg
patent: 5140219 (1992-08-01), Kane
patent: 5151061 (1992-09-01), Sandhu
patent: 5157304 (1992-10-01), Kane et al.
patent: 5207607 (1993-05-01), Nagano et al.
patent: 5223766 (1993-06-01), Nakayama et al.
patent: 5249732 (1993-10-01), Thomas
patent: 5361079 (1994-11-01), Yamamato
patent: 5381039 (1995-01-01), Morrison
patent: 5424605 (1995-06-01), Lovoi
patent: 5520563 (1996-05-01), Wallace et al.
patent: 5525861 (1996-06-01), Banno et al.
patent: 5577944 (1996-11-01), Taylor
patent: 5587622 (1996-12-01), Mohacsi
patent: 5589731 (1996-12-01), Fahlen et al.
Montgomery, Clive Richard, "Flip Chip Assemblies Using Conventional Wire Bonding Apparatus and Commercially Available Dies," ISHM '93 Proceedings, pp. 451-456.
IBM Technical Disclosure, "Direct Chip Bonding For Liquid Crystal Display", vol. 34, No. 5, Oct. 1991, pp 183-184.
"Liquid Crystal Display Products", Product Brochure, Standish LCD, Division of Standish Industries, Inc., pp. 5-6.
"Process-Stabilized Extrude Bonding Wire and Ribbon", Product Brochure, Hydrostatics Inc., Bethlehem PA, (Jun. 1991).
Kondoh, You et al. "A Subminiature CCD Module Using a New Assembly Technique", IEICE Transactions, vol.E 74, No. 8 Aug. 1991.
Cohen, I.M. et al. "Ball Formation Process in Aluminum Bonding Wire", Solid State Technology, pp. 89-92, Dec. 1985.
Levy, F. et al. "Phosphors for Full Color Microtips Fluorescent Displays", pp. 20-23, IEEE, 1991.
Kang, Sa-Yoon et al. Physical and Fuzzy Logic Modeling of a Flip-Chip Thermocompression Bonding Process, Journal of Electronic Packaging, pp. 63-70, Mar. 1993.
Charles, Jr., H.K. "Electronic Materials Handbook--Volume 1 Packaging", Product Brochure, ASM International.

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