Field emission devices employing improved emitters on metal foil

Electric lamp and discharge devices – Discharge devices having a multipointed or serrated edge...

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445 24, 445 50, 313311, H01J 130, H01J 902

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active

056486995

ABSTRACT:
The present invention provides improved methods for making field emission devices by which one can pre-deposit and bond the diamond particles or islands on a flexible metal foil at a desirably high temperature (e.g., near 900.degree. C. or higher), and then subsequently attach the high-quality- emitter-coated conductor foil onto the glass substrate. In addition to maximizing the field emitter properties, these methods provide high-speed, low-cost manufacturing. Since the field emitters can be pre-deposited on the metal foil in the form of long continuous sheet wound as a roll, the cathode assembly can be made by a high-speed, automated bonding process without having to subject each of the emitter-coated glass substrates to plasma heat treatment in a vacuum chamber.

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C. A. Spindt et al. "Field-Emiter Arrays for Vacuum Microelectronics," IEEE Transactions on Electron Devices, vol. 38, pp. 2355-2363 (1991).
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Okano et al., "Fabrication of a diamond field emitter array", Appl. Phys. Lett. vol. 64, p. 2742-2744 (May 1994).

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