Field emission device metallization including titanium tungsten

Details Field emission device metallization including titanium tungsten Field emission device metallization including titanium tungsten

1995-04-19

1997-01-14

O'Shea, Sandra L.

Electric lamp and discharge devices

Discharge devices having a multipointed or serrated edge...

313336, 313351, H01J 102, H01J 116, H01J 1910

Patent

active

055942970

ABSTRACT:
Titanium tungsten (Ti:W) and aluminum are used in a sublayering arrangement as the metallization material for the gate electrodes 60, cathode electrodes 20, bond pads 80 and 130, lead interconnects 100, 101, 120 and 121, and integrated circuit (IC) mount pads 90 and 91, on the emitter plate 10 of a field emission display. In a disclosed embodiment, titanium tungsten and aluminum sublayers are combined with niobium to provide the metallization material.

REFERENCES:
patent: 3653999 (1972-04-01), Fuller
patent: 3755704 (1973-08-01), Spindt et al.
patent: 4770897 (1988-09-01), Wu
patent: 4857161 (1989-08-01), Borel et al.
patent: 4857799 (1989-08-01), Spindt et al.
patent: 4940916 (1990-07-01), Borel et al.
patent: 5194780 (1993-03-01), Meyer
patent: 5225820 (1993-07-01), Clerc
patent: 5269878 (1993-12-01), Page et al.
patent: 5312514 (1994-05-01), Kumar
patent: 5319279 (1994-06-01), Watanabe et al.
patent: 5327327 (1994-07-01), Frew et al.
patent: 5329423 (1994-07-01), Scholz
patent: 5332627 (1994-07-01), Watanabe et al.
patent: 5382471 (1995-01-01), Arledge et al.

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