Field effect transistor, integrated circuit element, and...

Active solid-state devices (e.g. – transistors – solid-state diode – Thin active physical layer which is – Ballistic transport device

Reexamination Certificate

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C257S020000, C257S027000, C257S063000

Reexamination Certificate

active

07728324

ABSTRACT:
A field effect transistor of an embodiment of the present invention includes, a semiconductor substrate containing Si atoms; a protruding structure formed on the semiconductor substrate; a channel region formed in the protruding structure and containing Ge atoms; an under channel region formed under the channel region in the protruding structure and containing Si and Ge atoms, the Ge composition ratio among Si and Ge atoms contained in the under channel region continuously changing from the channel region side to the semiconductor substrate side; a gate insulating film formed on the channel region; and a gate electrode formed on the gate insulating film on the channel region.

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Notification of Reason for Rejection issued by the Japanese Patent Office on Jun. 27, 2008, for Japanese Patent Application No. 2006-182448, and English-language translation thereof.
Liow et al., “Investigation of silicon-germanium fins fabricated using germanium condensation on vertical compliant structures,” Applied Physics Letters (2005), 87:262104-1-262104-3.

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