Field-effect transistor having group III nitride electrode...

Active solid-state devices (e.g. – transistors – solid-state diode – Heterojunction device – Light responsive structure

Reexamination Certificate

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C257S183000, C257SE29127, C257SE29253

Reexamination Certificate

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07973335

ABSTRACT:
A field plate portion (5) overhanging a drain side in a visored shape is formed in a gate electrode (2). A multilayered film including a SiN film (21) and a SiO2film (22) is formed beneath the field plate portion (5). The SiN film (21) is formed so that a surface of an AlGaN electron supply layer (13) is covered therewith.

REFERENCES:
patent: 6483135 (2002-11-01), Mizuta et al.
patent: 6586813 (2003-07-01), Nagahara
patent: 2001/0015446 (2001-08-01), Inoue et al.
patent: 2001/0017370 (2001-08-01), Sheppard et al.
patent: 2002/0005528 (2002-01-01), Nagahara
patent: 2002/0043697 (2002-04-01), Hirokawa et al.
patent: 2003/0020092 (2003-01-01), Parikh et al.
patent: 2003/0235974 (2003-12-01), Martinez et al.
patent: 02-072667 (1990-03-01), None
patent: 08-083813 (1996-03-01), None
patent: 08-222579 (1996-08-01), None
patent: 09-027505 (1997-01-01), None
patent: 09-307097 (1997-11-01), None
patent: 09307097 (1997-11-01), None
patent: 2000-100831 (2000-04-01), None
patent: 2000-323495 (2000-11-01), None
patent: 2000323495 (2000-11-01), None
patent: 2000-353708 (2000-12-01), None
patent: 2001-189324 (2001-07-01), None
patent: 2001-230263 (2001-08-01), None
patent: 2002-100642 (2002-04-01), None
patent: 2002-359256 (2002-12-01), None
patent: 2002-359256 (2002-12-01), None
Ando et al., “A 110-W AlGaN/GaN Heterojunction FET on Thinned Sapphire Substrate,” IEDM 01, 2001, pp. 381-384.
Li et al., “High breakdown voltage GaN HFET with field plate,” Electronics Letters, Feb. 1, 2001, vol. 37, No. 3, pp. 196-197.
Mishra et al., “AlGaN/GaN HEMTs—An Overview of Device Operation and Applications,” Proceedings of the IEEE, Jun. 2002, vol. 90, No. 6, pp. 1022-1031.
Tan et al., “The Effect of Dielectric Stress on the Electrical Characteristics of AlGaN/GaN Heterostructure Field-Effect Transistors (HFETs),” The 10thIEEE International Symposium on Electron Devices for Microwave and Optelectronic Applications, Nov. 2002, pp. 130-135.
Zhang,N.Q. et al., “Effects of surface traps on breakdown voltage and switching speed of GaN power switching HEMTs,” 2001 IEEE, pp. 25.5.1-25.5.4.
Shawn T. Bradley et al., “Influence of A1GaN Deep Level Defects on A1GaN/GaN 2-DEG Carrier Confinement,” IEEE Transactions on Electron Devices, vol. 48:3, Mar. 2001, 7 pages.
J. Li et al, “High Breakdown Voltage GaN HFET With Field Plate,” Electronic Letters, Feb. 1, 2001, vol. 37:3, pp. 196-197.

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