Field-effect transistor and method of manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Junction field effect transistor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257283, 257284, 257194, H01L 2980

Patent

active

055856551

ABSTRACT:
On a semi-insulating substrate is formed a conductive layer and an undoped layer. On specified regions of the conductive layer are formed ohmic electrodes, each serving as a source electrode or a drain electrode, via a pair of square contact regions. The circumferential edges of the contact regions are undercut beneath the ohmic electrodes. Between the pair of contact regions on the conductive layer is formed a gate electrode by self alignment using the ohmic electrodes as a mask. The gate electrode has extended in the direction of gate width and the extended portion serves as a withdrawn portion of the gate electrode. Upper electrodes are formed by self alignment in the same process in which the gate electrode is formed.

REFERENCES:
patent: 3855690 (1974-12-01), Kim et al.
patent: 4004341 (1977-01-01), Tung
patent: 4325181 (1982-04-01), Yoder

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Field-effect transistor and method of manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Field-effect transistor and method of manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Field-effect transistor and method of manufacturing the same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1993528

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.