Field effect transistor

Active solid-state devices (e.g. – transistors – solid-state diode – Thin active physical layer which is – Heterojunction

Reexamination Certificate

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Details

C257S011000, C257S103000, C257S192000, C257SE21125, C257SE21129, C438S166000, C438S172000, C438S191000, C438S932000

Reexamination Certificate

active

07459718

ABSTRACT:
A FET includes a nitride semiconductor in which leak current is reduced and breakdown voltage is improved. The FET is formed from a substrate, a buffer layer made of a nitride semiconductor, a first semiconductor layer made of a nitride semiconductor, and a second semiconductor layer made of a nitride semiconductor, wherein at least the buffer layer and the first semiconductor layer include a p-type dopant. The concentration of the p-type dopant is higher in the buffer layer than that in the first semiconductor layer, and the concentration of the p-type dopant is higher in the first semiconductor layer than that in the second semiconductor layer.

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Rajan S. et al.; “MBE-Grown AlGaN/GaN HEMT's on SiC”, High Performance Devices, 2004, Proceedings, IEEE Lester Eastman Conference on Rensselaer Polytechnic Inst., Troy, NY, USA Aug. 4-6, 2004, Piscataway, NJ, USA, IEEE, Aug. 4, 2004, pp. 108-113, Xp010857764 ISBN: 981-256-196-X.

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