Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With means applying wave energy or electrical energy...
Reexamination Certificate
2005-05-03
2005-05-03
Ghyka, Alexander (Department: 2812)
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
With means applying wave energy or electrical energy...
C156S379600, C438S406000, C438S455000, C438S466000
Reexamination Certificate
active
06887342
ABSTRACT:
A method of field-assisted fusion bonding produces multiple-layer devices. Contacts (301, 303, 305, 307, 309) are placed at various points along different surfaces of a combination of two or more wafers (201, 203, 205, 501, 503, 505, 801, 803). An electric field is applied to the contacts (301, 303, 305, 307, 309), thereby creating an electrostatic attractive force between the wafers (201, 203, 205, 501, 503, 505, 801, 803). The temperature of the wafer combination is elevated to a fusion bonding temperature while the electric field is applied.
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Ghyka Alexander
Northrop Grumman Corporation
Patti & Brill LLC
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