Fiber optic module packaging architecture for integrated...

Details Fiber optic module packaging architecture for integrated... Fiber optic module packaging architecture for integrated...

2007-02-20

2007-02-20

Font, Frank G. (Department: 2883)

Optical waveguides

Integrated optical circuit

C385S015000, C385S033000, C385S052000

Reexamination Certificate

active

10787806

ABSTRACT:
A fiber optic module that includes a packaged integrated circuit chip mounted on a top surface of a printed circuit or other mounting board is disclosed. The integrated circuit chip is electrically coupled to an optical subassembly (OSA) mounted along an edge of the printed circuit board and capable of emitting or receiving light traveling parallel to the printed circuit board. The packaged IC chip is electrically coupled to the OSA through at least one microwave via extending through the board and a conductive trace formed on the opposed bottom surface of the board.

REFERENCES:
patent: 2004/0022476 (2004-02-01), Kirkpatrick et al.
patent: 2005/0025434 (2005-02-01), Benner et al.
patent: 2005/0135732 (2005-06-01), Crow et al.

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