Patent
1980-12-22
1984-02-28
Lee, John D.
350 9618, 350 9620, G02B 726
Patent
active
044338988
ABSTRACT:
A heat molded optical fiber interconnect molds one end of a plastic optical fiber around light emitting surfaces of a light source such as a light emitting diode to provide a highly efficient optical and mechanical coupling between the optical fiber and the light source. In one preferred embodiment an efficient interconnect for coupling large diameter optical fibers has a converging lens heat molded in the other end of the plastic optical fiber to efficiently couple light to another optical fiber or receiver.
REFERENCES:
patent: 4186996 (1980-02-01), Bowen et al.
patent: 4192574 (1980-03-01), Henry et al.
patent: 4257672 (1981-03-01), Balliet
patent: 4265511 (1981-05-01), Nicia et al.
patent: 4269648 (1981-05-01), Dakss et al.
patent: 4274707 (1981-06-01), Pacey et al.
patent: 4279465 (1981-07-01), Vojvodich
Gonzalez Frank
Lee John D.
National Semiconductor Corporation
Pollock Michael J.
Winters Paul J.
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