Fiber optic assembly

Details Fiber optic assembly Fiber optic assembly

1995-06-07

1997-11-18

Palmer, Phan T.

Optical waveguides

Accessories

Plug/termination device

385 78, 385 77, 385138, 165406, G02B 600

Patent

active

056896085

ABSTRACT:
A method of increasing the attachment bond strength between a first and second object comprising respective first and second materials is disclosed. Each of the first and second materials has a respective first coefficient of thermal expansion at an assembly temperature, and a second coefficient of thermal expansion at an operational temperature. The method has various steps (FIG. 4). An attachment surface of the first material is configured to be nonplanar (FIGS. 3a, 36, 37). The second material is brought to a contact point with the attachment surface of the first material (FIGS. 3b, 46). The first and second materials are heated at the contact point to the assembly temperature whereby at least one of the materials is caused to flow in response to the heat. Finally, the first and second materials are brought to the operational temperature, wherein at least one of the first and second materials is placed in a compressive state at the contact point due to the relative change in size of at least one of the first and second materials as compared with the change in size of the other of the first and second materials.

REFERENCES:
patent: 5155795 (1992-10-01), Wasserman et al.

Affiliated with

Also associated with

Rating

Fiber optic assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Fiber optic assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Fiber optic assembly will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1572132