Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering
Patent
1982-03-25
1983-08-30
Demers, Arthur P.
Chemistry: electrical and wave energy
Apparatus
Coating, forming or etching by sputtering
204192R, 204192M, C23C 1500
Patent
active
044015461
ABSTRACT:
A ferromagnetic, high-speed sputtering apparatus including an evacuable chamber, a substrate in the chamber, a target of ferromagnetic substance in the chamber facing the substrate, and magnetic field developing means in the chamber on the side of the target opposite the substrate. The target serves as a cathode. The target includes at least two separate segments of ferromagnetic substance which are spaced apart one from another by a gap so that a leakage magnetic field may be produced on the surface of the target facing the substrate. The gap may be less than about 3 mm. Each of the segments can include a ridge portion on the surface facing the substrate. Each ridge portion can have at least one apex and at least one slant surface.
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Chapin, The Planar Magnetism, Vacuum Technology, Technical Publishing Company, Research, Development, Jan. 1974, pp. 37-40.
Vorous, Planar Magnetron Sputtering, A New Industrial Coating Technique, Vac-Tec Systems, Boulder, Colorado, pp. 62-66.
Nakamura Kyuzo
Ohta Yoshifumi
Yamada Taiki
Demers Arthur P.
Nihon Shinku Gijutsu Kabushiki Kaisha
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