Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Subsequent separation into plural bodies
Reexamination Certificate
2007-01-16
2007-01-16
Hoang, Quoc (Department: 2818)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
Subsequent separation into plural bodies
C438S003000, C438S508000, C438S464000, C438S508000, C438S745000
Reexamination Certificate
active
10803479
ABSTRACT:
A ferroelectric element manufacturing method includes the steps of forming a buffer layer, which also functions as a sacrificial layer, on a single crystal substrate, forming a ferroelectric film on the buffer layer, separating the ferroelectric film and the single crystal substrate, and arranging the ferroelectric film that was separated from the single crystal substrate on an optional substrate.
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Higuchi Takamitsu
Iwashita Setsuya
Miyazawa Hiromu
Harness & Dickey & Pierce P.L.C.
Hoang Quoc
Seiko Epson Corporation
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