Ferroelectric nonvolatile transistor and method of making same

Details Ferroelectric nonvolatile transistor and method of making same Ferroelectric nonvolatile transistor and method of making same

1998-11-05

2000-04-11

Monin, Jr., Donald L.

Semiconductor device manufacturing: process

Having magnetic or ferroelectric component

438369, 438542, 257295, H01L 2976

Patent

active

060487402

ABSTRACT:
A method of fabricating a ferroelectric memory transistor using a lithographic process having an alignment tolerance of .delta., includes preparing a silicon substrate for construction of a ferroelectric gate unit; implanting boron ions to form a p- well in the substrate; isolating plural device areas on the substrate; forming a FE gate stack surround structure; etching the FE gate stack surround structure to form an opening having a width of L1 to expose the substrate in a gate region; depositing oxide to a thickness of between about 10 nm to 40 nm over the exposed substrate; forming a FE gate stack over the gate region, wherein the FE gate stack has a width of L2, wherein L2.gtoreq.L1+2.delta.; depositing a first insulating layer over the structure; implanting arsenic or phosphorous ions to form a source region and a drain region; annealing the structure; depositing a second insulating layer; and metallizing the structure. A ferroelectric memory transistor includes a silicon substrate having a p- well formed therein; a gate region, a source region and a drain region disposed along the upper surface of said substrate; a FE gate stack surround structure having an opening having a width of L1 located about said gate region; a FE gate stack formed in said FE gate stack surround structure, wherein said FE gate stack has a width of L2, wherein L2.gtoreq.L1+2.delta., wherein .delta. is the alignment tolerance of the lithographic process.

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