Ferrite to metal bond for high-power microwave applications

Details Ferrite to metal bond for high-power microwave applications Ferrite to metal bond for high-power microwave applications

1974-10-08

1976-06-01

Rutledge, L. Dewayne

Metal working

Means to assemble or disassemble

Puller or pusher means, contained force multiplying operator

B32B 1504

Patent

active

039605124

ABSTRACT:
A ferrite-to-metal bond suitable for the environment of a high-power microwave circulator is disclosed. The bonding surface of a gyromagnetic ferrite or garnet button is metallized by a sputtering process that deposits successive layers of nichrome, copper and gold thereon. During the sputtering process, a flexible stainless steel band surrounds the button to prevent sputtered material from being deposited on other than the bonding surface of the button. The metallized bonding surface is then soldered to a metal wall of the circulator. The bond so formed is capable of withstanding a peak power level in the circulator of 2.0 megawatts and an average power level of 3.5 kilowatts under standing-wave conditions.

REFERENCES:
patent: 2957238 (1960-10-01), Harvey et al.
patent: 3226226 (1965-12-01), Braun
patent: 3323912 (1967-06-01), Bolda et al.
patent: 3505041 (1970-04-01), Bronnes et al.

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