Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1993-02-11
1995-01-03
Jones, W. Gary
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
15624415, 156250, 156271, 156259, 156433, 156441, 156 52, 29 2542, 264174, 264139, 264148, 264149, 336 84M, 336233, 336234, 336223, C03B 2900
Patent
active
053782976
ABSTRACT:
A ferrite chip bead includes a ferrite substrate, a plurality of outer electrodes formed at opposite sides of the ferrite substrate, and a plurality of conductive leads each extending transversely through the ferrite substrate and having opposite ends protruded outwardly of opposite side surfaces of the ferrite substrate and connected to corresponding outer electrodes. Conductive leads are embedded in the ferrite substrate by introducing conductive leads in a central portion of a nozzle for extruding the ferrite substrate such that the conductive leads are embedded in the ferrite substrate being extruded, or by introducing conductive leads between ferrite substrate sheets being fed to be bonded together for forming the ferrite substrate such that the conductive leads are interposed between the ferrite substrate sheets being bonded. The ferrite chip has no tendency for outer electrodes to short-circuit from the ferrite substrate upon carrying the chip bead on a circuit board. Manufacture is simplified and short circuits are prevented, thus enhancing reliability and productivity.
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Chang Dong S.
Lee Sang S.
Boam R&D Co., Ltd.
De Simone Mark
Jones W. Gary
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